16. Development of Heat Sinks for Electronics Cooling
Period:
2005 / 2006
Description:
The main objective of this project is to improve heat removal from electronics, such as Peltier cooling modules, personal computer CPU's, among others. The heat sink employs vapor chamber technology. This concept has been reported as the most efficient for heat spreading in small volumes. The traditional concept is reaching the technological limit, making it impossible to enhance heat spreading without increasing size.
Members:
Alexandre Silveira de Oliveira
Marcia Barbosa Henriques Mantelli
Willian de Souza
